Streamlined IC mask layout optical and process correction through correction reuse

An EDA tool is provided with an OPC module that performs optical and/or process pre-compensations on an IC mask layout in a streamlined manner, reusing determined corrections for a first area on a second area, when the second area is determined to be equivalent to the first area for OPC purposes. Th...

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Bibliographische Detailangaben
1. Verfasser: Cobb, Nicolas B
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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