Heat sink and electromagnetic interference reduction device
An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to...
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| creator | Stewart, Thomas E Furuta, Steven J |
| description | An electrical assembly comprising a circuit board an electrical device, and a heat dissipation device. The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape. |
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The electrical device is capable of emitting thermal energy and electromagnetic interference (EMI). The electrical device is secured to the circuit board. The heat dissipation device is secured to the circuit board and is in thermal communication with the electrical device. The heat dissipation device also includes a continuous EMI fence and a plurality of fins disposed in a matrix orientation. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape.</abstract><oa>free_for_read</oa></addata></record> |
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| source | USPTO Issued Patents |
| title | Heat sink and electromagnetic interference reduction device |
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