Apparatus for polishing a semiconductor wafer

An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming...

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Hauptverfasser:	Boo, Jae-Phil, Ryu, Jun-Gyu, Lee, Sang-Seon, Lee, Sun-Wung
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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