Modular semiconductor workpiece processing tool

The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Berner, Robert W, Woodruff, Daniel J, Schmidt, Wayne J, Coyle, Kevin W, Zila, Vladimir, Lund, Worm
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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