Plastic integrated circuit package and method and leadframe for making the package
Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the cont...
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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