Method of fabricating microelectronic package having a bumpless laminated interconnection layer

Method of fabricating microelectronic package having a bumpless laminated interconnection layer

A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the opening(s) with an encapsulation material, that encapsulates at least one microelectronic die...

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Hauptverfasser: Towle, Steven, Wermer, Paul H
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Sprache:eng
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creator Towle, Steven
Wermer, Paul H
description A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the opening(s) with an encapsulation material, that encapsulates at least one microelectronic die within an encapsulation material without a microelectronic package core, or that secures at least one microelectronic die within at least one opening in a heat spreader. A laminated interconnector of dielectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device.
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A laminated interconnector of dielectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device.</abstract><oa>free_for_read</oa></addata></record>
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title Method of fabricating microelectronic package having a bumpless laminated interconnection layer
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