Resistivity analysis

Resistivity analysis

According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path...

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Hauptverfasser: Bruce, Michael R, Bruce, Victoria J, Ring, Rosalinda M, Cole, Edward Jr. I, Hawkins, Charles F, Tangyungong, Paiboon
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Sprache:eng
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creator Bruce, Michael R
Bruce, Victoria J
Ring, Rosalinda M
Cole, Edward Jr. I
Hawkins, Charles F
Tangyungong, Paiboon
description According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07062399</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07062399</sourcerecordid><originalsourceid>FETCH-uspatents_grants_070623993</originalsourceid><addsrcrecordid>eNrjZBAJSi3OLC7JLMssqVRIzEvMqQRyeRhY0xJzilN5oTQ3g4Kba4izh25pcUFiSWpeSXF8elEiiDIwNzAzMra0NCZCCQBjcCIk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Resistivity analysis</title><source>USPTO Issued Patents</source><creator>Bruce, Michael R ; Bruce, Victoria J ; Ring, Rosalinda M ; Cole, Edward Jr. I ; Hawkins, Charles F ; Tangyungong, Paiboon</creator><creatorcontrib>Bruce, Michael R ; Bruce, Victoria J ; Ring, Rosalinda M ; Cole, Edward Jr. I ; Hawkins, Charles F ; Tangyungong, Paiboon ; Advance Micro Devices, Inc</creatorcontrib><description>According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.</description><language>eng</language><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7062399$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7062399$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bruce, Michael R</creatorcontrib><creatorcontrib>Bruce, Victoria J</creatorcontrib><creatorcontrib>Ring, Rosalinda M</creatorcontrib><creatorcontrib>Cole, Edward Jr. I</creatorcontrib><creatorcontrib>Hawkins, Charles F</creatorcontrib><creatorcontrib>Tangyungong, Paiboon</creatorcontrib><creatorcontrib>Advance Micro Devices, Inc</creatorcontrib><title>Resistivity analysis</title><description>According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZBAJSi3OLC7JLMssqVRIzEvMqQRyeRhY0xJzilN5oTQ3g4Kba4izh25pcUFiSWpeSXF8elEiiDIwNzAzMra0NCZCCQBjcCIk</recordid><startdate>20060613</startdate><enddate>20060613</enddate><creator>Bruce, Michael R</creator><creator>Bruce, Victoria J</creator><creator>Ring, Rosalinda M</creator><creator>Cole, Edward Jr. I</creator><creator>Hawkins, Charles F</creator><creator>Tangyungong, Paiboon</creator><scope>EFH</scope></search><sort><creationdate>20060613</creationdate><title>Resistivity analysis</title><author>Bruce, Michael R ; Bruce, Victoria J ; Ring, Rosalinda M ; Cole, Edward Jr. I ; Hawkins, Charles F ; Tangyungong, Paiboon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_070623993</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Bruce, Michael R</creatorcontrib><creatorcontrib>Bruce, Victoria J</creatorcontrib><creatorcontrib>Ring, Rosalinda M</creatorcontrib><creatorcontrib>Cole, Edward Jr. I</creatorcontrib><creatorcontrib>Hawkins, Charles F</creatorcontrib><creatorcontrib>Tangyungong, Paiboon</creatorcontrib><creatorcontrib>Advance Micro Devices, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bruce, Michael R</au><au>Bruce, Victoria J</au><au>Ring, Rosalinda M</au><au>Cole, Edward Jr. I</au><au>Hawkins, Charles F</au><au>Tangyungong, Paiboon</au><aucorp>Advance Micro Devices, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resistivity analysis</title><date>2006-06-13</date><risdate>2006</risdate><abstract>According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.</abstract><oa>free_for_read</oa></addata></record>
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title Resistivity analysis
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T08%3A17%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Bruce,%20Michael%20R&rft.aucorp=Advance%20Micro%20Devices,%20Inc&rft.date=2006-06-13&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07062399%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true