Method for forming interconnections between channels and chambers

Method for forming interconnections between channels and chambers

A method of forming interconnections between channels and/or chambers for use in a micro-fluidic device. Two planer substrates (usually glass and silicon respectively) having etched channels are bonded together to form volmes where the channels overlap. A manifolding cut is then made through the gla...

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Hauptverfasser: Shaw, John Edward Andrew, Turner, Chris
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Sprache:eng
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Turner, Chris
description A method of forming interconnections between channels and/or chambers for use in a micro-fluidic device. Two planer substrates (usually glass and silicon respectively) having etched channels are bonded together to form volmes where the channels overlap. A manifolding cut is then made through the glass, intersecting glass channels only. An organic solution is passed into cut, and flows through silicon channels. An aqueous solution is passed into cut, and flows through glass channels. The solutions meet in the region, where matter is transferred from one solution to another.
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Two planer substrates (usually glass and silicon respectively) having etched channels are bonded together to form volmes where the channels overlap. A manifolding cut is then made through the glass, intersecting glass channels only. An organic solution is passed into cut, and flows through silicon channels. An aqueous solution is passed into cut, and flows through glass channels. The solutions meet in the region, where matter is transferred from one solution to another.</abstract><oa>free_for_read</oa></addata></record>
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title Method for forming interconnections between channels and chambers
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