Plating uniformity control by contact ring shaping

An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality o...

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Hauptverfasser: Herchen, Harald, Hao, Henan, Esteban, Celina M, Webb, Timothy R, Trinh, Son N
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Sprache:eng
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creator Herchen, Harald
Hao, Henan
Esteban, Celina M
Webb, Timothy R
Trinh, Son N
description An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
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The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.</abstract><oa>free_for_read</oa></addata></record>
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title Plating uniformity control by contact ring shaping
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