Method of attaching optical waveguide component to printed circuit board

Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide co...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kim, Young-Woo, Cho, Young-Sang, Yang, Dek-Gin, Yim, Kyu-Hyok
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Kim, Young-Woo
Cho, Young-Sang
Yang, Dek-Gin
Yim, Kyu-Hyok
description Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07025849</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07025849</sourcerecordid><originalsourceid>FETCH-uspatents_grants_070258493</originalsourceid><addsrcrecordid>eNqNyz0OwjAMQOEsDAi4gy-AVPEjYEaturCxI-O4qaUSR4kD1wckDsD0Le_NXX9hG9WDDoBmSKPEAJpMCCd44ZNDFc9A-kgaORqYQsoSjT2QZKpicFfMfulmA06FVz8XDrr2eu7XtSS0z1luIeOX5tBs9sfdaftH8gaFhzWA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of attaching optical waveguide component to printed circuit board</title><source>USPTO Issued Patents</source><creator>Kim, Young-Woo ; Cho, Young-Sang ; Yang, Dek-Gin ; Yim, Kyu-Hyok</creator><creatorcontrib>Kim, Young-Woo ; Cho, Young-Sang ; Yang, Dek-Gin ; Yim, Kyu-Hyok ; Samsung Electro-Mechanics Co., Ltd</creatorcontrib><description>Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.</description><language>eng</language><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7025849$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7025849$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Young-Woo</creatorcontrib><creatorcontrib>Cho, Young-Sang</creatorcontrib><creatorcontrib>Yang, Dek-Gin</creatorcontrib><creatorcontrib>Yim, Kyu-Hyok</creatorcontrib><creatorcontrib>Samsung Electro-Mechanics Co., Ltd</creatorcontrib><title>Method of attaching optical waveguide component to printed circuit board</title><description>Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNyz0OwjAMQOEsDAi4gy-AVPEjYEaturCxI-O4qaUSR4kD1wckDsD0Le_NXX9hG9WDDoBmSKPEAJpMCCd44ZNDFc9A-kgaORqYQsoSjT2QZKpicFfMfulmA06FVz8XDrr2eu7XtSS0z1luIeOX5tBs9sfdaftH8gaFhzWA</recordid><startdate>20060411</startdate><enddate>20060411</enddate><creator>Kim, Young-Woo</creator><creator>Cho, Young-Sang</creator><creator>Yang, Dek-Gin</creator><creator>Yim, Kyu-Hyok</creator><scope>EFH</scope></search><sort><creationdate>20060411</creationdate><title>Method of attaching optical waveguide component to printed circuit board</title><author>Kim, Young-Woo ; Cho, Young-Sang ; Yang, Dek-Gin ; Yim, Kyu-Hyok</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_070258493</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Kim, Young-Woo</creatorcontrib><creatorcontrib>Cho, Young-Sang</creatorcontrib><creatorcontrib>Yang, Dek-Gin</creatorcontrib><creatorcontrib>Yim, Kyu-Hyok</creatorcontrib><creatorcontrib>Samsung Electro-Mechanics Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Young-Woo</au><au>Cho, Young-Sang</au><au>Yang, Dek-Gin</au><au>Yim, Kyu-Hyok</au><aucorp>Samsung Electro-Mechanics Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of attaching optical waveguide component to printed circuit board</title><date>2006-04-11</date><risdate>2006</risdate><abstract>Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_07025849
source USPTO Issued Patents
title Method of attaching optical waveguide component to printed circuit board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T14%3A33%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kim,%20Young-Woo&rft.aucorp=Samsung%20Electro-Mechanics%20Co.,%20Ltd&rft.date=2006-04-11&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07025849%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true