Semiconductor device and manufacturing the same

A semiconductor device capable of attaining the reduction of size is disclosed. The semiconductor device comprises a module substrate having a surface and a back surface, a control chip mounted on the surface of the module substrate, plural chip parts mounted on the surface in adjacency to the contr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Negishi, Mikio, Noto, Hiroki, Yamada, Tomio, Endoh, Tsuneo
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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