Electronic component mounting apparatus and electronic component mounting method

Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact e...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Yakiyama, Hideyuki, Emoto, Yasuhiro
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Yakiyama, Hideyuki Emoto, Yasuhiro
description	Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.
format	Patent
fullrecord	<record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06999184</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06999184</sourcerecordid><originalsourceid>FETCH-uspatents_grants_069991843</originalsourceid><addsrcrecordid>eNrjZAhwzUlNLinKz8tMVkjOzy3Iz0vNK1HIzS_NK8nMS1dILChILEosKS1WSMxLUUjFqzY3tSQjP4WHgTUtMac4lRdKczMouLmGOHvolhYXJJYANRTHpxclgigDM0tLS0MLE2MilAAA65A5fg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component mounting apparatus and electronic component mounting method</title><source>USPTO Issued Patents</source><creator>Yakiyama, Hideyuki ; Emoto, Yasuhiro</creator><creatorcontrib>Yakiyama, Hideyuki ; Emoto, Yasuhiro ; Matsushita Electric Industrial Co., Ltd</creatorcontrib><description>Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.</description><language>eng</language><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6999184$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6999184$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yakiyama, Hideyuki</creatorcontrib><creatorcontrib>Emoto, Yasuhiro</creatorcontrib><creatorcontrib>Matsushita Electric Industrial Co., Ltd</creatorcontrib><title>Electronic component mounting apparatus and electronic component mounting method</title><description>Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZAhwzUlNLinKz8tMVkjOzy3Iz0vNK1HIzS_NK8nMS1dILChILEosKS1WSMxLUUjFqzY3tSQjP4WHgTUtMac4lRdKczMouLmGOHvolhYXJJYANRTHpxclgigDM0tLS0MLE2MilAAA65A5fg</recordid><startdate>20060214</startdate><enddate>20060214</enddate><creator>Yakiyama, Hideyuki</creator><creator>Emoto, Yasuhiro</creator><scope>EFH</scope></search><sort><creationdate>20060214</creationdate><title>Electronic component mounting apparatus and electronic component mounting method</title><author>Yakiyama, Hideyuki ; Emoto, Yasuhiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_069991843</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Yakiyama, Hideyuki</creatorcontrib><creatorcontrib>Emoto, Yasuhiro</creatorcontrib><creatorcontrib>Matsushita Electric Industrial Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yakiyama, Hideyuki</au><au>Emoto, Yasuhiro</au><aucorp>Matsushita Electric Industrial Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component mounting apparatus and electronic component mounting method</title><date>2006-02-14</date><risdate>2006</risdate><abstract>Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_uspatents_grants_06999184
source	USPTO Issued Patents
title	Electronic component mounting apparatus and electronic component mounting method
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T14%3A02%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yakiyama,%20Hideyuki&rft.aucorp=Matsushita%20Electric%20Industrial%20Co.,%20Ltd&rft.date=2006-02-14&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06999184%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true