Reduced footprint tool for automated processing of microelectronic substrates

The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool function...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Larson, Robert E, Simondet, Sean D, Zimmerman, David C, Maciej, Todd K, Matthys, Quirin W
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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