Heating configuration for use in thermal processing chambers

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices...

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Bibliographische Detailangaben
Hauptverfasser: Koren, Zion, O'Carroll, Conor Patrick, Choy, Shuen Chun, Timans, Paul Janis, Cardema, Rudy Santo Tomas, Taoka, James Tsuneo, Strod, Arieh A
Format: Patent
Sprache:eng
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