Heating configuration for use in thermal processing chambers

Heating configuration for use in thermal processing chambers

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices...

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Hauptverfasser: Koren, Zion, O'Carroll, Conor Patrick, Choy, Shuen Chun, Timans, Paul Janis, Cardema, Rudy Santo Tomas, Taoka, James Tsuneo, Strod, Arieh A
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Sprache:eng
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creator Koren, Zion
O'Carroll, Conor Patrick
Choy, Shuen Chun
Timans, Paul Janis
Cardema, Rudy Santo Tomas
Taoka, James Tsuneo
Strod, Arieh A
description An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
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title Heating configuration for use in thermal processing chambers
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