Padless structure design for easy identification of bridging defects in lines by passive voltage contrast

A new test structure to locate bridging defects in a conductive layer of an integrated circuit device is achieved. The test structure comprises a line comprising a conductive layer overlying a substrate. The line is coupled to ground. A plurality of rectangles comprises the conductive layer. The rec...

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Bibliographische Detailangaben

Hauptverfasser:	Song, Zhigang, Redkar, Shailesh, Oh, Chong Khiam
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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