Enhanced pad design for substrate

A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact...

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Bibliographische Detailangaben

Hauptverfasser:	Garrity, John Joseph, McMorran, John James Hannah
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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