Crack propagation stops for dicing of planar lightwave circuit devices

One aspect of the present invention relates to a method of dicing a substrate containing a plurality of non-rectangular shaped optical integrated circuits, involving forming stop cracks in the wafer, each stop crack adjacent and substantially parallel one of the non-rectangular shaped optical integr...

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Hauptverfasser:	Calkins, Chris P, Cole, Robert
Format:	Patent
Sprache:	eng
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creator	Calkins, Chris P Cole, Robert
description	One aspect of the present invention relates to a method of dicing a substrate containing a plurality of non-rectangular shaped optical integrated circuits, involving forming stop cracks in the wafer, each stop crack adjacent and substantially parallel one of the non-rectangular shaped optical integrated circuits, and cutting the substrate in a curvilinear manner substantially parallel to a stop crack. Another aspect of the present invention relates to an optical structure containing a substrate; a plurality of non-rectangular shaped optical integrated circuits on the substrate, each non-rectangular shaped optical integrated circuit having an active region; and at least one stop crack positioned adjacent each non-rectangular shaped optical integrated circuit.
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title	Crack propagation stops for dicing of planar lightwave circuit devices
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