Measurement of lateral diffusion of diffused layers

Any semiconductor wafer fabrication process may be changed to monitor lateral abruptness of doped layers as an additional step in the wafer fabrication process. In one embodiment, a test structure including one or more doped regions is formed in a production wafer (e.g. simultaneously with one or mo...

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Bibliographische Detailangaben
Hauptverfasser: Borden, Peter G, Kluth, G. Jonathan, Paton, Eric
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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