Semiconductor device

A flip-chip BGA is disclosed which exhibits an excellent high-speed electric transmission characteristic while minimizing the formation of voids in sealing resin filled between a semiconductor chip and a wiring substrate. A silicon chip is flip-chip-mounted on a package substrate, and in a central a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Katagiri, Mitsuaki, Usami, Masami, Ujiie, Kenji
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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