Memory device and fabrication method thereof

A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be forme...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Shin, Yoo-cheol, Choi, Jeong-Hyuk, Hur, Sung-Hoi
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Shin, Yoo-cheol
Choi, Jeong-Hyuk
Hur, Sung-Hoi
description A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06867453</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06867453</sourcerecordid><originalsourceid>FETCH-uspatents_grants_068674533</originalsourceid><addsrcrecordid>eNrjZNDxTc3NL6pUSEkty0xOVUjMS1FIS0wqykxOLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMzCzNzE1NiYCCUAaZ8quw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Memory device and fabrication method thereof</title><source>USPTO Issued Patents</source><creator>Shin, Yoo-cheol ; Choi, Jeong-Hyuk ; Hur, Sung-Hoi</creator><creatorcontrib>Shin, Yoo-cheol ; Choi, Jeong-Hyuk ; Hur, Sung-Hoi ; Samsung Electronics Co., Ltd</creatorcontrib><description>A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.</description><language>eng</language><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6867453$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6867453$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shin, Yoo-cheol</creatorcontrib><creatorcontrib>Choi, Jeong-Hyuk</creatorcontrib><creatorcontrib>Hur, Sung-Hoi</creatorcontrib><creatorcontrib>Samsung Electronics Co., Ltd</creatorcontrib><title>Memory device and fabrication method thereof</title><description>A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZNDxTc3NL6pUSEkty0xOVUjMS1FIS0wqykxOLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMzCzNzE1NiYCCUAaZ8quw</recordid><startdate>20050315</startdate><enddate>20050315</enddate><creator>Shin, Yoo-cheol</creator><creator>Choi, Jeong-Hyuk</creator><creator>Hur, Sung-Hoi</creator><scope>EFH</scope></search><sort><creationdate>20050315</creationdate><title>Memory device and fabrication method thereof</title><author>Shin, Yoo-cheol ; Choi, Jeong-Hyuk ; Hur, Sung-Hoi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_068674533</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Shin, Yoo-cheol</creatorcontrib><creatorcontrib>Choi, Jeong-Hyuk</creatorcontrib><creatorcontrib>Hur, Sung-Hoi</creatorcontrib><creatorcontrib>Samsung Electronics Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shin, Yoo-cheol</au><au>Choi, Jeong-Hyuk</au><au>Hur, Sung-Hoi</au><aucorp>Samsung Electronics Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Memory device and fabrication method thereof</title><date>2005-03-15</date><risdate>2005</risdate><abstract>A method of forming a memory device, where a first insulator layer and a charge trapping layer may be formed on a substrate, and at least one of the first insulator layer and charge trapping layer may be patterned to form patterned areas. A second insulation layer and a conductive layer may be formed on the patterned areas, and one or more of the conductive layer, second insulator layer, charge trapping layer and first insulator layer may be patterned to form a string selection line, ground selection line, a plurality of word lines between the string selection and ground selection lines on the substrate, a low voltage gate electrode, and a plurality of insulators of varying thickness. The formed memory device may be a NAND-type non-volatile memory device having a SONOS gate structure, for example.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06867453
source USPTO Issued Patents
title Memory device and fabrication method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T19%3A42%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Shin,%20Yoo-cheol&rft.aucorp=Samsung%20Electronics%20Co.,%20Ltd&rft.date=2005-03-15&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06867453%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true