Method to increase cracking threshold for low-k materials
23 A method of increasing the cracking threshold of a low-k material layer comprising the following steps. A substrate having a low-k material layer formed thereover is provided. The low-k material layer having a cracking threshold. The low-k material layer is plasma treated to increase the low-k ma...
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| creator | Li, Lih-Ping Lu, Yung-Chen Ko, Chung-Chi |
| description | 23 A method of increasing the cracking threshold of a low-k material layer comprising the following steps. A substrate having a low-k material layer formed thereover is provided. The low-k material layer having a cracking threshold. The low-k material layer is plasma treated to increase the low-k material layer cracking threshold. The plasma treatment including a gas that is CO, He, NHor combinations thereof. |
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| title | Method to increase cracking threshold for low-k materials |
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