Release resistant electrical interconnections for MEMS devices

A release resistant electrical interconnection comprising a gold-based electrical conductor compression bonded directly to a highly-doped polysilicon bonding pad in a MEMS, IMEMS, or MOEMS device, without using any intermediate layers of aluminum, titanium, solder, or conductive adhesive disposed in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Peterson, Kenneth A, Garrett, Stephen E, Reber, Cathleen A
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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