Interconnect module with reduced power distribution impedance

Interconnect module with reduced power distribution impedance

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated cir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Sylvester, Mark F, Hanson, David A, Petefish, William G
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Sylvester, Mark F
Hanson, David A
Petefish, William G
description An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06847527</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06847527</sourcerecordid><originalsourceid>FETCH-uspatents_grants_068475273</originalsourceid><addsrcrecordid>eNrjZLD1zCtJLUrOz8tLTS5RyM1PKc1JVSjPLMlQKEpNKU1OTVEoyC9PLVJIySwuKcpMKi3JzM9TyMwtSE1JzEtO5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrAzMLE3NTI3JgIJQBB3THd</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Interconnect module with reduced power distribution impedance</title><source>USPTO Issued Patents</source><creator>Sylvester, Mark F ; Hanson, David A ; Petefish, William G</creator><creatorcontrib>Sylvester, Mark F ; Hanson, David A ; Petefish, William G ; 3M Innovative Properties Company</creatorcontrib><description>An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.</description><language>eng</language><creationdate>2005</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6847527$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6847527$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Sylvester, Mark F</creatorcontrib><creatorcontrib>Hanson, David A</creatorcontrib><creatorcontrib>Petefish, William G</creatorcontrib><creatorcontrib>3M Innovative Properties Company</creatorcontrib><title>Interconnect module with reduced power distribution impedance</title><description>An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2005</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLD1zCtJLUrOz8tLTS5RyM1PKc1JVSjPLMlQKEpNKU1OTVEoyC9PLVJIySwuKcpMKi3JzM9TyMwtSE1JzEtO5WFgTUvMKU7lhdLcDApuriHOHrqlxQWJJal5JcXx6UWJIMrAzMLE3NTI3JgIJQBB3THd</recordid><startdate>20050125</startdate><enddate>20050125</enddate><creator>Sylvester, Mark F</creator><creator>Hanson, David A</creator><creator>Petefish, William G</creator><scope>EFH</scope></search><sort><creationdate>20050125</creationdate><title>Interconnect module with reduced power distribution impedance</title><author>Sylvester, Mark F ; Hanson, David A ; Petefish, William G</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_068475273</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2005</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Sylvester, Mark F</creatorcontrib><creatorcontrib>Hanson, David A</creatorcontrib><creatorcontrib>Petefish, William G</creatorcontrib><creatorcontrib>3M Innovative Properties Company</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sylvester, Mark F</au><au>Hanson, David A</au><au>Petefish, William G</au><aucorp>3M Innovative Properties Company</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Interconnect module with reduced power distribution impedance</title><date>2005-01-25</date><risdate>2005</risdate><abstract>An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06847527
source USPTO Issued Patents
title Interconnect module with reduced power distribution impedance
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T02%3A03%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Sylvester,%20Mark%20F&rft.aucorp=3M%20Innovative%20Properties%20Company&rft.date=2005-01-25&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06847527%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true