Dual wafer load lock

A method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body having a first port disposed in a first wall and a second port disposed in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kraus, Joseph Arthur, Strassner, James David
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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