Semiconductor package with recessed leadframe and a recessed leadframe

A semiconductor package is provided that includes a flat leadframe having front and rear faces. The leadframe includes a central platform and elongate electrical connection leads distributed around this platform. Electrical connection wires connect the chip to the front face of the leads, and encaps...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Diot, Jean-Luc
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!