Method of mounting a component in an edge-plated hole formed in a printed circuit board

This application relates generally to the field of electrical circuits and in particular to the manufacture of multi-layer printed circuit boards. A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.