Method of manufacturing an integrated circuit package

The present invention relates to integrated circuit packaging and manufacturing thereof, and more particularly, to integrated circuit packaging for improved dissipation of thermal energy. In one aspect, the present invention features a method of manufacturing an integrated circuit package including...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	McLellan, Neil Robert, Fan, Chun Ho, Combs, Edward G, Cheung, Tsang Kwok, Keung, Chow Lap, Labeeb, Sadak Thamby
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!