Semiconductor device having a moveable member therein and a protective member disposed thereon
1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is d...
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| Sprache: | eng |
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