Semiconductor device having a moveable member therein and a protective member disposed thereon

Semiconductor device having a moveable member therein and a protective member disposed thereon

1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is d...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Fujii, Tetsuo, Fukada, Tsuyoshi, Ao, Kenichi
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Fujii, Tetsuo
Fukada, Tsuyoshi
Ao, Kenichi
description 1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06787866</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06787866</sourcerecordid><originalsourceid>FETCH-uspatents_grants_067878663</originalsourceid><addsrcrecordid>eNqNyrEKwjAURuEuDqK-w30BQRDS7qK466zcJr_theYmJGmeX0VxdjrDd5bN7QIvNqibbQmJHKpY0MhVdCAmHyq4n0AevkeiMiJBlFjdS2MKBbZI_bmTHEOG-4xB183iwVPG5ttVQ6fj9XDezjlygZZ8HxK_szNt13bG7P9YngxvPdM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device having a moveable member therein and a protective member disposed thereon</title><source>USPTO Issued Patents</source><creator>Fujii, Tetsuo ; Fukada, Tsuyoshi ; Ao, Kenichi</creator><creatorcontrib>Fujii, Tetsuo ; Fukada, Tsuyoshi ; Ao, Kenichi ; Denso Corporation</creatorcontrib><description>1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6787866$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6787866$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Fujii, Tetsuo</creatorcontrib><creatorcontrib>Fukada, Tsuyoshi</creatorcontrib><creatorcontrib>Ao, Kenichi</creatorcontrib><creatorcontrib>Denso Corporation</creatorcontrib><title>Semiconductor device having a moveable member therein and a protective member disposed thereon</title><description>1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNyrEKwjAURuEuDqK-w30BQRDS7qK466zcJr_theYmJGmeX0VxdjrDd5bN7QIvNqibbQmJHKpY0MhVdCAmHyq4n0AevkeiMiJBlFjdS2MKBbZI_bmTHEOG-4xB183iwVPG5ttVQ6fj9XDezjlygZZ8HxK_szNt13bG7P9YngxvPdM</recordid><startdate>20040907</startdate><enddate>20040907</enddate><creator>Fujii, Tetsuo</creator><creator>Fukada, Tsuyoshi</creator><creator>Ao, Kenichi</creator><scope>EFH</scope></search><sort><creationdate>20040907</creationdate><title>Semiconductor device having a moveable member therein and a protective member disposed thereon</title><author>Fujii, Tetsuo ; Fukada, Tsuyoshi ; Ao, Kenichi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_067878663</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Fujii, Tetsuo</creatorcontrib><creatorcontrib>Fukada, Tsuyoshi</creatorcontrib><creatorcontrib>Ao, Kenichi</creatorcontrib><creatorcontrib>Denso Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fujii, Tetsuo</au><au>Fukada, Tsuyoshi</au><au>Ao, Kenichi</au><aucorp>Denso Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device having a moveable member therein and a protective member disposed thereon</title><date>2004-09-07</date><risdate>2004</risdate><abstract>1. Field of the Invention A protective sheet is fixed to a jig, and regions of the protective sheet corresponding to regions where dicing-cut is to be performed are removed to form grooves. Then, a semiconductor wafer is bonded to the protective sheet at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together. After that, the semiconductor wafer is cut into semiconductor chips by dicing along the grooves of the protective sheet. Because the protective sheet is not cut by dicing, no scraps of the protective sheet is produced, thereby preventing contamination to the chips.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06787866
source USPTO Issued Patents
title Semiconductor device having a moveable member therein and a protective member disposed thereon
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T00%3A06%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Fujii,%20Tetsuo&rft.aucorp=Denso%20Corporation&rft.date=2004-09-07&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06787866%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true