Packaged microelectronic component assemblies

This application claims foreign priority benefits of Singapore Application No. 200204998-9 filed Aug. 19, 2002, the entirety of which is incorporated herein by reference. Various aspects of the present invention provide microelectronic component assemblies and methods for packaging such assemblies....

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Bibliographische Detailangaben

1. Verfasser:	Heng, Puah Kia
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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