Solder reserve transfer device and process

The invention is directed to printed circuit boards (PCB) or the like, to electronic devices for interconnecting PCBs, to devices for mounting PCBs onto a substrate, and to processes for solder attaching electronic components to a substrate. The invention is also particularly concerned with attaching a daughter card to a motherboard, especially to permanently attach a daughter card perpendicular to a motherboard. A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.