Hermetic silicon carbide
The invention is related to the field of hermetic barrier layers in integrated circuits, in particular, silicon carbide barrier layers. Hermetic amorphous doped silicon carbide is deposited on an integrated circuit substrate in a PECVD reactor. Nitrogen-doping of an SiC film is conducted by flowing...
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creator | Fu, Haiying Wong, Ka Shun Tang, Xingyuan Huang, Judy Hsiu-Chih van Schravendijk, Bart Jan |
description | The invention is related to the field of hermetic barrier layers in integrated circuits, in particular, silicon carbide barrier layers.
Hermetic amorphous doped silicon carbide is deposited on an integrated circuit substrate in a PECVD reactor. Nitrogen-doping of an SiC film is conducted by flowing nitrogen-containing molecules, preferably nitrogen or ammonia gas, into the reactor chamber together with an organosilane, preferably tetramethylsilane, and forming a plasma. Oxygen-doping is conducted by flowing oxygen-containing molecules into the reaction chamber. |
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fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06777349</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06777349</sourcerecordid><originalsourceid>FETCH-uspatents_grants_067773493</originalsourceid><addsrcrecordid>eNrjZJDwSC3KTS3JTFYozszJTM7PU0hOLErKTEnlYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpRYkgysDM3Nzc2MTSmAglANfVIy8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Hermetic silicon carbide</title><source>USPTO Issued Patents</source><creator>Fu, Haiying ; Wong, Ka Shun ; Tang, Xingyuan ; Huang, Judy Hsiu-Chih ; van Schravendijk, Bart Jan</creator><creatorcontrib>Fu, Haiying ; Wong, Ka Shun ; Tang, Xingyuan ; Huang, Judy Hsiu-Chih ; van Schravendijk, Bart Jan ; Novellus Systems, Inc</creatorcontrib><description>The invention is related to the field of hermetic barrier layers in integrated circuits, in particular, silicon carbide barrier layers.
Hermetic amorphous doped silicon carbide is deposited on an integrated circuit substrate in a PECVD reactor. Nitrogen-doping of an SiC film is conducted by flowing nitrogen-containing molecules, preferably nitrogen or ammonia gas, into the reactor chamber together with an organosilane, preferably tetramethylsilane, and forming a plasma. Oxygen-doping is conducted by flowing oxygen-containing molecules into the reaction chamber.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6777349$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6777349$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Fu, Haiying</creatorcontrib><creatorcontrib>Wong, Ka Shun</creatorcontrib><creatorcontrib>Tang, Xingyuan</creatorcontrib><creatorcontrib>Huang, Judy Hsiu-Chih</creatorcontrib><creatorcontrib>van Schravendijk, Bart Jan</creatorcontrib><creatorcontrib>Novellus Systems, Inc</creatorcontrib><title>Hermetic silicon carbide</title><description>The invention is related to the field of hermetic barrier layers in integrated circuits, in particular, silicon carbide barrier layers.
Hermetic amorphous doped silicon carbide is deposited on an integrated circuit substrate in a PECVD reactor. Nitrogen-doping of an SiC film is conducted by flowing nitrogen-containing molecules, preferably nitrogen or ammonia gas, into the reactor chamber together with an organosilane, preferably tetramethylsilane, and forming a plasma. Oxygen-doping is conducted by flowing oxygen-containing molecules into the reaction chamber.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZJDwSC3KTS3JTFYozszJTM7PU0hOLErKTEnlYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpRYkgysDM3Nzc2MTSmAglANfVIy8</recordid><startdate>20040817</startdate><enddate>20040817</enddate><creator>Fu, Haiying</creator><creator>Wong, Ka Shun</creator><creator>Tang, Xingyuan</creator><creator>Huang, Judy Hsiu-Chih</creator><creator>van Schravendijk, Bart Jan</creator><scope>EFH</scope></search><sort><creationdate>20040817</creationdate><title>Hermetic silicon carbide</title><author>Fu, Haiying ; Wong, Ka Shun ; Tang, Xingyuan ; Huang, Judy Hsiu-Chih ; van Schravendijk, Bart Jan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_067773493</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Fu, Haiying</creatorcontrib><creatorcontrib>Wong, Ka Shun</creatorcontrib><creatorcontrib>Tang, Xingyuan</creatorcontrib><creatorcontrib>Huang, Judy Hsiu-Chih</creatorcontrib><creatorcontrib>van Schravendijk, Bart Jan</creatorcontrib><creatorcontrib>Novellus Systems, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Fu, Haiying</au><au>Wong, Ka Shun</au><au>Tang, Xingyuan</au><au>Huang, Judy Hsiu-Chih</au><au>van Schravendijk, Bart Jan</au><aucorp>Novellus Systems, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Hermetic silicon carbide</title><date>2004-08-17</date><risdate>2004</risdate><abstract>The invention is related to the field of hermetic barrier layers in integrated circuits, in particular, silicon carbide barrier layers.
Hermetic amorphous doped silicon carbide is deposited on an integrated circuit substrate in a PECVD reactor. Nitrogen-doping of an SiC film is conducted by flowing nitrogen-containing molecules, preferably nitrogen or ammonia gas, into the reactor chamber together with an organosilane, preferably tetramethylsilane, and forming a plasma. Oxygen-doping is conducted by flowing oxygen-containing molecules into the reaction chamber.</abstract><oa>free_for_read</oa></addata></record> |
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title | Hermetic silicon carbide |
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