Apparatus with compliant electrical terminals, and methods for forming same

This patent application is related to a co-pending patent application Ser. No. 09/952,337 (attorney reference number 3003.000800/DC10179) entitled "Semiconductor Device With Compliant Electrical Terminals, Apparatus Including The Semiconductor Device, and Methods for Forming Same" by Michael A. Lutz and filed on the same day as the present patent application. An apparatus is disclosed including an electrical conductor and an electrically conductive, compliant bump formed on the electrical conductor. The compliant bump includes an electrically conductive, solderable capping layer and an electrically conductive, compliant body positioned between the solderable capping layer and the electrical conductor. The compliant body electrically couples the solderable capping layer to the electrical conductor. The electrical conductor may be, for example, an input/output (I/O) pad of the apparatus, and the compliant bump may form an electrical terminal of the apparatus. The compliant body forms a mechanically flexible, electrically conductive path between the solderable capping layer and the electrical conductor. The compliant bump deforms elastically when subjected to a force exerted between the solderable capping layer and the electrical conductor, allowing the compliant bump to form a highly reliable connection between the apparatus and an external element. Several embodiments of the compliant bump, and methods for forming the compliant bump, are presented.