Method of manufacturing semiconductor device having resin sealing body

This invention relates to a technique that is applied to a semiconductor device, especially to a semiconductor device having a base substrate that comprises flexible films. In a method of forming a ball grid array type semiconductor package, a semiconductor chip is mounted through an adhesive materi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fujisawa, Atsushi, Konno, Takafumi, Ohsaka, Shingo, Haruta, Ryo, Ichitani, Masahiro
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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