Electronic assembly having high interconnection density

The present invention relates to an electronic assembly having high-density interconnections. A particular application of the invention lies in the field of integrated electronic modules, i.e. modules comprising a plurality of specialized integrated circuits known as application specific integrated circuits (ASICs). These ASICs perform numerous complex functions, and for them to operate it is necessary for a large number of inlet and outlet ports on the module to be served. The field of the invention is particularly that of integrated modules of three-dimensional structure, and in a preferred example, in the form of a cube. An electronic assembly comprising an electronic module provided with optical interconnection and heat removal means, the heat removal means comprising a soleplate dedicated to removing heat on which the module is mounted. The interconnection means is independent of the soleplate and preferably comprises a printed circuit and an optical fiber included in the printed circuit. The optical fiber has an end put accurately in register with an optical contact of the module by a BGA type mounting of the printed circuit on the module. A BGA type mounting consists in placing with precision firstly balls on the module and secondly areas on the circuit, and then in bringing the balls and areas face to face so that the balls center themselves automatically with the areas by capillarity.