Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing station

The present invention relates generally to semiconductor fabrication and, more particularly, to an edge roller assembly, a method for contacting an edge of a substrate, and a transport system for transporting semiconductor wafers to a wafer processing station. An edge roller assembly includes first...

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Bibliographische Detailangaben

Hauptverfasser:	Gardner, Douglas G, Smith, Stephen Mark, Bliven, Brian M
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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