Polishing pad with release layer

This invention relates to a multi-layered polishing pad having separable layers for modifying an exposed surface of a semiconductor wafer. A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad rep...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Kessel, Carl R
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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