Plastic packaging of LED arrays

This invention relates generally to semiconductor device packaging and specifically to plastic packaging of light emitting diode ("LED") arrays. There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of t...

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Bibliographische Detailangaben

Hauptverfasser:	Durocher, Kevin Matthew, Balch, Ernest Wayne, Krishnamurthy, Vikram B, Saia, Richard Joseph, Cole, Herbert Stanley, Kolc, Ronald Frank
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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