Method and device for laser drilling laminates

The invention generally relates to laser drilling. A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	De Steur, Hubert, Heerman, Marcel, Van Puymbroeck, Jozef
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	De Steur, Hubert Heerman, Marcel Van Puymbroeck, Jozef
description	The invention generally relates to laser drilling. A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width
format	Patent
fullrecord	<record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06713719</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06713719</sourcerecordid><originalsourceid>FETCH-uspatents_grants_067137193</originalsourceid><addsrcrecordid>eNrjZNDzTS3JyE9RSMxLUUhJLctMTlVIyy9SyEksTi1SSCnKzMnJzEsHcnMz8xJLUot5GFjTEnOKU3mhNDeDgptriLOHbmlxAVA-r6Q4Pr0oEUQZmJkbGpsbWhoToQQAsGwrPA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method and device for laser drilling laminates</title><source>USPTO Issued Patents</source><creator>De Steur, Hubert ; Heerman, Marcel ; Van Puymbroeck, Jozef</creator><creatorcontrib>De Steur, Hubert ; Heerman, Marcel ; Van Puymbroeck, Jozef ; Siemens Aktiengesellschaft</creatorcontrib><description>The invention generally relates to laser drilling. A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency 30 kHz for the metal layer and 20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6713719$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64015</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6713719$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>De Steur, Hubert</creatorcontrib><creatorcontrib>Heerman, Marcel</creatorcontrib><creatorcontrib>Van Puymbroeck, Jozef</creatorcontrib><creatorcontrib>Siemens Aktiengesellschaft</creatorcontrib><title>Method and device for laser drilling laminates</title><description>The invention generally relates to laser drilling. A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency 30 kHz for the metal layer and 20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZNDzTS3JyE9RSMxLUUhJLctMTlVIyy9SyEksTi1SSCnKzMnJzEsHcnMz8xJLUot5GFjTEnOKU3mhNDeDgptriLOHbmlxAVA-r6Q4Pr0oEUQZmJkbGpsbWhoToQQAsGwrPA</recordid><startdate>20040330</startdate><enddate>20040330</enddate><creator>De Steur, Hubert</creator><creator>Heerman, Marcel</creator><creator>Van Puymbroeck, Jozef</creator><scope>EFH</scope></search><sort><creationdate>20040330</creationdate><title>Method and device for laser drilling laminates</title><author>De Steur, Hubert ; Heerman, Marcel ; Van Puymbroeck, Jozef</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_067137193</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>De Steur, Hubert</creatorcontrib><creatorcontrib>Heerman, Marcel</creatorcontrib><creatorcontrib>Van Puymbroeck, Jozef</creatorcontrib><creatorcontrib>Siemens Aktiengesellschaft</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>De Steur, Hubert</au><au>Heerman, Marcel</au><au>Van Puymbroeck, Jozef</au><aucorp>Siemens Aktiengesellschaft</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and device for laser drilling laminates</title><date>2004-03-30</date><risdate>2004</risdate><abstract>The invention generally relates to laser drilling. A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency 30 kHz for the metal layer and 20 kHz for the dielectric layer, and wavelength=532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_uspatents_grants_06713719
source	USPTO Issued Patents
title	Method and device for laser drilling laminates
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T03%3A52%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=De%20Steur,%20Hubert&rft.aucorp=Siemens%20Aktiengesellschaft&rft.date=2004-03-30&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06713719%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true