Method and apparatus for applying downward force on wafer during CMP
The present invention relates to chemical mechanical planarization (CMP) techniques and, more particularly, to a method for applying downward force on a wafer during CMP and an apparatus for applying a wafer to a polishing surface during a CMP operation. An apparatus for applying a wafer to a polish...
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| Format: | Patent |
| Sprache: | eng |
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