Method and apparatus for applying downward force on wafer during CMP

Method and apparatus for applying downward force on wafer during CMP

The present invention relates to chemical mechanical planarization (CMP) techniques and, more particularly, to a method for applying downward force on a wafer during CMP and an apparatus for applying a wafer to a polishing surface during a CMP operation. An apparatus for applying a wafer to a polish...

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Hauptverfasser: de la Llera, Anthony, Pham, Xuyen, Siu, Andrew, Nguyen, Tuan A, Luong, Tony
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Sprache:eng
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creator de la Llera, Anthony
Pham, Xuyen
Siu, Andrew
Nguyen, Tuan A
Luong, Tony
description The present invention relates to chemical mechanical planarization (CMP) techniques and, more particularly, to a method for applying downward force on a wafer during CMP and an apparatus for applying a wafer to a polishing surface during a CMP operation. An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.
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title Method and apparatus for applying downward force on wafer during CMP
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