Die-in-heat spreader microelectronic package

1. Field of the Invention Microelectronic packages including a microelectronic die disposed within a recess in a heat spreader and build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die and the heat spreader to form the microelectronic package, a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ma, Qing, Fujimoto, Harry H, Towle, Steven, Evert, John E
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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