Orthogonal interface for connecting circuit boards carrying differential pairs

Certain embodiments of the present invention generally relate to connectors that electrically connect circuit boards to one another and more particularly relate to electrical contacts that join differential pairs of signal traces on first and second electrical wafers orthogonally aligned with one another. An electrical connector assembly is provided including a plurality of wafers having ground and signal traces with the signal traces being arranged in differential pairs, a first connector housing including channels adapted to retain a first group of wafers, and a second connector housing including channels adapted to retain a second group of wafers. The electrical connector assembly also includes signal contacts joining the differential pairs of the signal traces on the first group of wafers with corresponding differential pairs of the signal traces on the second group of wafers. The first and second connector housings join the first group of wafers in a non-parallel relationship to the second group of wafers.