Plating apparatus and plating liquid removing method

1. Field of the Invention A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with a subst...

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Bibliographische Detailangaben
Hauptverfasser: Sendai, Satoshi, Tomioka, Kenya, Tsuda, Katsumi
Format: Patent
Sprache:eng
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