Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization

1. Field of the Invention A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and a...

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Bibliographische Detailangaben

Hauptverfasser:	Jiyan, Dai, Foong, Tee Siam, Lam, Tai Chui, Er, Eddie, Redkar, Shailesh
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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