Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization

Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization

1. Field of the Invention A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and a...

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Hauptverfasser: Jiyan, Dai, Foong, Tee Siam, Lam, Tai Chui, Er, Eddie, Redkar, Shailesh
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Sprache:eng
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creator Jiyan, Dai
Foong, Tee Siam
Lam, Tai Chui
Er, Eddie
Redkar, Shailesh
description 1. Field of the Invention A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and attached to a sample holder. Areas of the IC chip are removed by polishing until a region surrounding a particular contact or via is exposed. The piece of glass supports the IC chip during the polishing process. The IC chip is cut using a focused ion beam to create a thin membrane suitable for TEM failure analysis. The thin membrane includes a plan-view cross-section from the particular contact or via. The cross-sectional plan-view is perpendicular to the longitudinal axis of the contact or via.
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Field of the Invention A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and attached to a sample holder. Areas of the IC chip are removed by polishing until a region surrounding a particular contact or via is exposed. The piece of glass supports the IC chip during the polishing process. The IC chip is cut using a focused ion beam to create a thin membrane suitable for TEM failure analysis. The thin membrane includes a plan-view cross-section from the particular contact or via. The cross-sectional plan-view is perpendicular to the longitudinal axis of the contact or via.</abstract><oa>free_for_read</oa></addata></record>
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title Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization
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