Multi-step transmission line for multilayer packaging
The field of the invention is that of packaging integrated circuits for high speed applications. In packaging integrated circuits for high speed (multi-gigabit) applications, chip carriers having signal paths between the substrate board and the chips at the top with a number of evenly divided vertic...
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| creator | Pillai, Edward R Dyckman, Warren D |
| description | The field of the invention is that of packaging integrated circuits for high speed applications.
In packaging integrated circuits for high speed (multi-gigabit) applications, chip carriers having signal paths between the substrate board and the chips at the top with a number of evenly divided vertical steps produces frequency properties that are sufficiently good that it is possible to run signals through the package, rather than by means of connectors attached to the top surface of the carrier. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06680530</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06680530</sourcerecordid><originalsourceid>FETCH-uspatents_grants_066805303</originalsourceid><addsrcrecordid>eNrjZDD1Lc0pydQtLkktUCgpSswrzs0sLs7Mz1PIycxLVUjLL1LIBSnISaxMLVIoSEzOTkzPzEvnYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpQMOAlIGZmYWBqbGBMRFKAHl8Lpw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multi-step transmission line for multilayer packaging</title><source>USPTO Issued Patents</source><creator>Pillai, Edward R ; Dyckman, Warren D</creator><creatorcontrib>Pillai, Edward R ; Dyckman, Warren D ; International Business Machines Corporation</creatorcontrib><description>The field of the invention is that of packaging integrated circuits for high speed applications.
In packaging integrated circuits for high speed (multi-gigabit) applications, chip carriers having signal paths between the substrate board and the chips at the top with a number of evenly divided vertical steps produces frequency properties that are sufficiently good that it is possible to run signals through the package, rather than by means of connectors attached to the top surface of the carrier.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6680530$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6680530$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Pillai, Edward R</creatorcontrib><creatorcontrib>Dyckman, Warren D</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Multi-step transmission line for multilayer packaging</title><description>The field of the invention is that of packaging integrated circuits for high speed applications.
In packaging integrated circuits for high speed (multi-gigabit) applications, chip carriers having signal paths between the substrate board and the chips at the top with a number of evenly divided vertical steps produces frequency properties that are sufficiently good that it is possible to run signals through the package, rather than by means of connectors attached to the top surface of the carrier.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDD1Lc0pydQtLkktUCgpSswrzs0sLs7Mz1PIycxLVUjLL1LIBSnISaxMLVIoSEzOTkzPzEvnYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpQMOAlIGZmYWBqbGBMRFKAHl8Lpw</recordid><startdate>20040120</startdate><enddate>20040120</enddate><creator>Pillai, Edward R</creator><creator>Dyckman, Warren D</creator><scope>EFH</scope></search><sort><creationdate>20040120</creationdate><title>Multi-step transmission line for multilayer packaging</title><author>Pillai, Edward R ; Dyckman, Warren D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_066805303</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Pillai, Edward R</creatorcontrib><creatorcontrib>Dyckman, Warren D</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Pillai, Edward R</au><au>Dyckman, Warren D</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-step transmission line for multilayer packaging</title><date>2004-01-20</date><risdate>2004</risdate><abstract>The field of the invention is that of packaging integrated circuits for high speed applications.
In packaging integrated circuits for high speed (multi-gigabit) applications, chip carriers having signal paths between the substrate board and the chips at the top with a number of evenly divided vertical steps produces frequency properties that are sufficiently good that it is possible to run signals through the package, rather than by means of connectors attached to the top surface of the carrier.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Multi-step transmission line for multilayer packaging |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T07%3A27%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Pillai,%20Edward%20R&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2004-01-20&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06680530%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |