Method for connecting electronic components to a substrate, and a method for checking such a connection

The present invention relates to a method for connecting electronic components to a carrier substrate an arrangement for connecting electronic components to a carrier substrate and a method for examining a connection between electronic components and a carrier substrate. A method for connecting an e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Benzler, Jan, Hoebel, Albert-Andreas, Schmidt, Gerhard, Rupprecht, Stefan, Ruzicka, Thomas, Schuetz, Reiner, Hongquan, Jiang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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