Method and apparatus for removing heat from an electronic device

Method and apparatus for removing heat from an electronic device

1. Field of the Invention The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted withi...

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Hauptverfasser: Tantoush, Mohammed A, Kitlas, Kenneth
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Sprache:eng
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creator Tantoush, Mohammed A
Kitlas, Kenneth
description 1. Field of the Invention The electronic device with a system for enhancing the cooling of components located therein is provided. The device includes a housing with a fan positioned adjacent the housing and adapted for producing airflow within the housing. The printed circuit board is mounted within the housing, and a heat-producing device is mounted on the printed circuit board. The heatsink is coupled to the heat-producing device, and a shroud is mounted on the printed circuit board and extends up to the heatsink so as to improve airflow in the region adjacent the heatsink.
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title Method and apparatus for removing heat from an electronic device
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